Besi 9800 TC Next
CGI Animation · Animation
This 3D technical animation showcases the Besi 9800 TC Next — an advanced thermo-compression die attach system designed for next generation semiconductor packaging and chiplet applications.
The animation highlights key process steps, machine functionality, and precision bonding capabilities used in high-accuracy assembly environments.
The 9800 TC Next is engineered for superior alignment accuracy, thin-die handling, and advanced process control for modern packaging requirements.
The visualization focuses on system operation, bonding workflow, and machine architecture to clearly communicate complex semiconductor manufacturing technology.
For more info: www.besi.com
Client: Besi
Agency: Vizburg
Production: Massless Studio